Thermal SIL PAD® Materials - Henkel Adhesives
2021-7-17u2002·u2002Q-PAD ® Materials - Non-electrically Conductive Thermal Protection. Bergquist® SIL PAD ® TSP Q type materials are a composite of aluminum foil - or glassweave reinforced. They are coated on both sides with thermally and electrically-conductive SIL PAD ® rubber.. These materials are designed to be used in those applications where maximum heat transfer is needed and electrical isolation is ...
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